日前,由国(guo)家信(xin)息(xi)光(guang)电子(zi)创(chuang)新中心、光(guang)迅科(ke)技(ji)、光(guang)纤通(tong)(tong)信(xin)技(ji)术和(he)网络国(guo)家重点实验室、中国(guo)信(xin)息(xi)通(tong)(tong)信(xin)科(ke)技(ji)集(ji)团联合研制成(cheng)功的“100G硅光(guang)收发芯片(pian)”正式(shi)投产使(shi)用,实现100G/200G全集(ji)成(cheng)硅基(ji)相干光(guang)收发集(ji)成(cheng)芯片(pian)和(he)器件的量产,并(bing)通(tong)(tong)过(guo)了用户现网测试,性能(neng)稳定可靠。该系(xi)列产品支(zhi)持(chi)100~200Gb/s高速(su)光(guang)信(xin)号传输(shu),具备超小型、高性能(neng)、低成(cheng)本(ben)、通(tong)(tong)用化等优点,可广泛应用于传输(shu)网和(he)数据中心光(guang)传输(shu)设备。
该(gai)款商(shang)用化硅(gui)光芯片在一个(ge)不到30平(ping)方毫米的(de)硅(gui)芯片上集成了(le)包括光发(fa)送(song)、调(diao)制、接收(shou)等近(jin)60个(ge)有源和无源光元(yuan)件,是目(mu)前国际(ji)上已报道的(de)集成度(du)最(zui)高(gao)的(de)商(shang)用硅(gui)光子集成芯片之一。该(gai)芯片完成封(feng)装(zhuang)后(hou),其(qi)硅(gui)光器(qi)件产(chan)品的(de)尺(chi)寸仅(jin)为312平(ping)方毫米,面积为传统器(qi)件的(de)三分之一,可以全面满足CFP/CFP2(外形(xing)封(feng)装(zhuang)可插拔(ba))相干(gan)光模块的(de)需求。
图(tu):商用100G/200G硅基相干光收(shou)发(a)芯片和(b)器件;实测硅光器件的(de)(c) 128Gb/s PDM-QPSK和(d) 256Gb/s PDM-16QAM光星座图(tu)
国(guo)家信(xin)息光(guang)(guang)(guang)(guang)电(dian)(dian)子(zi)创新中心专(zhuan)家委员会主任余少(shao)华院士表示:“硅材料(liao)来(lai)源丰富(fu),成本低,机(ji)械性(xing)能(neng)、耐(nai)高(gao)温能(neng)力(li)非(fei)常好,便于芯(xin)(xin)片(pian)(pian)加工(gong)和封装。借助集成电(dian)(dian)路(lu)已(yi)(yi)大规模商(shang)用的CMOS工(gong)艺平台实(shi)现(xian)硅光(guang)(guang)(guang)(guang)芯(xin)(xin)片(pian)(pian)的生产制造,可以(yi)有效解决我(wo)(wo)国(guo)高(gao)端光(guang)(guang)(guang)(guang)电(dian)(dian)子(zi)芯(xin)(xin)片(pian)(pian)制造能(neng)力(li)薄(bo)弱、工(gong)艺能(neng)力(li)不足的问(wen)题(ti)。不过,硅材料(liao)属间接带隙半导体材料(liao),需要解决硅基光(guang)(guang)(guang)(guang)源加工(gong)和众多光(guang)(guang)(guang)(guang)元(yuan)件集成难题(ti);硅材料(liao)不存在线性(xing)电(dian)(dian)光(guang)(guang)(guang)(guang)效应和光(guang)(guang)(guang)(guang)电(dian)(dian)探(tan)测功能(neng),也(ye)需要解决调制器(qi)加工(gong)和锗硅外延生长难题(ti)。加上硅光(guang)(guang)(guang)(guang)芯(xin)(xin)片(pian)(pian)对高(gao)端光(guang)(guang)(guang)(guang)器(qi)件的带宽、集成度、性(xing)能(neng)、功耗、可靠(kao)性(xing)和成本等要求极高(gao),使得多年来(lai)硅光(guang)(guang)(guang)(guang)芯(xin)(xin)片(pian)(pian)一直是(shi)我(wo)(wo)国(guo)光(guang)(guang)(guang)(guang)通信(xin)行业的一只拦路(lu)虎。此次(ci)工(gong)信(xin)部(bu)主导成立国(guo)家信(xin)息光(guang)(guang)(guang)(guang)电(dian)(dian)子(zi)创新中心,及时推动四家单位通力(li)合作实(shi)现(xian)了(le)100G硅光(guang)(guang)(guang)(guang)芯(xin)(xin)片(pian)(pian)的产业化商(shang)用,不仅展(zhan)现(xian)出硅光(guang)(guang)(guang)(guang)技术(shu)优势,也(ye)表明我(wo)(wo)国(guo)已(yi)(yi)经具备了(le)硅光(guang)(guang)(guang)(guang)产品商(shang)用化设计(ji)的条件和基础(chu)。我(wo)(wo)们十分期待未来(lai)几年硅光(guang)(guang)(guang)(guang)技术(shu)在光(guang)(guang)(guang)(guang)通信(xin)系统中的大规模部(bu)署和应用,推动我(wo)(wo)国(guo)自主硅光(guang)(guang)(guang)(guang)芯(xin)(xin)片(pian)(pian)技术(shu)向(xiang)超高(gao)速超大容量超长距离、高(gao)集成度、高(gao)性(xing)能(neng)、低功耗、高(gao)可靠(kao)的方向(xiang)发展(zhan)。”